AOI-DFO30为兼容CHIP/COC/COS/BAR/晶圆外观检查所开发的高精度机型,以机器视觉检测为主,能同时检测P/正面(金线面)、N/底面、AR和HR面四个面。

AOI-DFO30 is a high-precision model developed for compatibility with CHIP/COC/COS/BAR/Wafer Appearance Inspection. It focuses on machine vision inspection and is capable of inspecting four surfaces at the same time, namely, P/Front Side (Gold Line Side), N/Bottom Side, AR, and HR surfaces.

AOI-DF030检测像素精度达到了0.03μm(即30nm),可检出0.1μm以上的缺陷，检出率高达99.8%以上，为行业领先水平；是国内首家清晰稳定完成芯片端面100X高精度成像并且检测的高精度机型；

The pixel accuracy of AO1-DF030 reaches 0.03μm (i.e. 30nm), which can detect defects above 0.1μm, with a detection rate as high as 99.8%, which is the leading level in the industry. It is the first high-precision model in China to clearly and stably complete the 100X high-precision imaging and inspection of the chip end face.

AOI-DF030具有多类产品兼容功能，可兼容CHIP/COC/COS/BAR/晶圆的检测需求，一机多用；

AOI-DF030 has the function of multi-product compatibility, compatible with CHIP/COC/COS/BAR/wafers inspection needs, multi-purpose machine.

AOI-DF030具备大量自研AI算法，确保检测精度,突破了国外同行的技术封锁,达到最佳检测效果；还支持芯片检测后,通过液态CO₂主动清洗芯片脏污等功能；

AOI-DF030 has a large number of self-developed AI algorithms to ensure the detection accuracy, break through the technical blockade of foreign counterparts, to achieve the best detection results. Also supports the chip detection, through the liquid CO₂ active cleaning of the chip dirt and other functions.