湖南奥创普科技有限公Hunan Ultra Precision Intelligent Technology Co.,Ltd.

全自动智能共晶贴片机 TP300(Fully Automatic Intelligent Eutectic Bonder)

设备占地面积(含操作区域):2000mm×1240mm×2100mm
芯片尺寸 Chip Size:长宽 0.4mm-1.0mm 厚度 0.1-0.4mm
基板尺寸 Substrate Size:长宽 2.0mm- 6.0mm 厚度 0.5-2.0mm
贴片效率 Patch Efficiency:20-24秒/片
贴片精度 Patch Precision:±2μm@3σ
贴片良率 Patch Yield:≥ 99.8%
产品详情

AOI-TP300全自动智能共晶贴片机是一款兼容多种上下料方式、单管四面检测、全自动共晶贴片、COC四面检测的多功能机型。

AOI-TP300 is a multifunctional model that is compatible with multiple loading and unloading methods, single-tube four-side inspection, fully automatic eutectic die bonding, and COC four-side inspection.

AOI-TP300自带单管供料检测功能,对于单管正面、背面、端面进行检测,检测合格的芯片直接供料到贴片模组进行贴片,还具备选配功能,可自主选择供料(单管)检测部分;

AOI-TP300 comes with a single-tube supply inspection function, which can detect the front, back, and end faces of a single tube. Qualified chips are directly supplied to the patch module for bonding, it also has an optional function, you can independently select the supply (single-tube)inspection part.

AOI-TP300人工智能AI算法迭代,可实时检测贴片效果,同时可实现芯片基板上下料采用配方功能,通过算法配方搭配更换不同芯片与基板组合,更加快捷方便的更换不同的贴片组合;

AOI-TP300 artificial intelligence Al algorithm iteration can detect the chip placement effect in real-time,while achieve the function of using formula for chip substrate loading and unloading. By matching the algorithm formula with different chip and substrate combinations, different bonding combinations can be replaced more quickly and conveniently.

AOI-TP300以大理石为主体结构,并具备高精度的视觉定位机构及高灵敏度的压力控制机构,可实现高精度、高稳定性的贴片效果,贴片良率高达99.8%;

AOl-TP300 takes marble as the main structure, and has high-precision visual positioning mechanism and high-sensitivity pressure control mechanism, which can achieve high-precision and high-stability bonding effect with a bonding yield of up to 99.8%.


Utra Precision
服务时间:周一至周日 9:00-18:00
服务电话:0731-85180984
地址:湖南省长沙市岳麓区桐梓坡西路519号宇顺科  技园湖南奥创普科技有限公司 联系邮箱:acp16688@163.com
手机号码:15073239201(高女士)
关注我们
关注公众号,订阅小程序,了解更多资讯
联系我们