FC520用于倒装芯片的超高精度贴片生产工艺，其具有自动上下料、及自动贴片的功能，并具备高精度的视觉定位机构及高灵敏度的压力控制机构，可实现高精度、高稳定性的贴片效果，适合存储、逻辑、模拟等芯片的高速高精度生产。

FC520 is used for ultra-high-precision patch production process of flip-chip, with automatic loading and unloading, and automatic patch function, as well as high-precision visual positioning mechanism and high-sensitivity pressure control mechanism, which can realize high-precision and high-stability patch effect, and it is suitable for high-speed and high-precision production of chips of memory, logic, and analog.

FC520配备高精度的双龙门结构运动平台,具备优良的减振运动控制；配备高精度、可编程压力闭环控制的双焊头贴片结构，可实现高效率、高精度、高稳定性的贴片工艺；

FC520 is equipped with high-precision double gantry structure motion platform, with excellent vibration damping motion control; equipped with high-precision, programmable pressure closed-loop control of the dual soldering head placement structure, which can realize high-efficiency, high-precision, high-stability placement process.

FC520配备2*6多吸嘴工位,极大的提高生产效率。配备视觉对位及校正功能，对吸嘴水平位置进行自动校核并动态补偿，确保贴片尺寸精度；

FC520 is equipped with 2*6 multi-tip stations, which greatly improves the production efficiency. Equipped with visual alignment and calibration function, the horizontal position of the nozzle is automatically calibrated and dynamically compensated to ensure the dimensional accuracy of the patching.

FC520可兼容晶圆上料、JEDEC托盘、Waffle托盘、卷带式上料,使产线的切换更灵活；

FC520 is compatible with wafer loading, JEDEC trays, Waffle trays, and tape-and-reel loading, making line switching more flexible.

FC520配备优异的视觉检测功能，可对晶圆、基板和助焊剂等关键参数进行实时检测，在生产过程中检测芯片缺陷确保贴片质量；

FC520 is equipped with excellent visual inspection functions for real-time inspection of key parameters such as wafers, substrates and fluxes, and detects chip defects during the production process to ensure placement quality.