AOI-D170设备主要用于半导体激光芯片的全自动视觉检测分选( 兼容Chip及Bar检测需求，一机多用），采用先进的基于人工智能AI的机器视觉检测技术和独特的双通道布局设计。

AOI-D170 is mainly used for fully automatic visual inspection and sorting of semiconductor laser chips (compatible with Chip and Bar inspection requirements, multi-purpose), adopting advanced AI-based machine vision inspection technology and unique dualchannel layout design.

独创AI算法突破了国外同行的技术封锁，通过基本图层、AI图层功能等进行优化，达到最佳检测效果；还支持芯片的自动识别（芯片尺寸、位置、ID号等信息）、自动聚焦、定位、拾取、检测、产品高度检测等功能；

The original Al algorithm has broken through the technical blockade of foreign peers, and optimized through basic layers, Al layer functions, etc. to achieve the best detection effect. It also supports automatic chip identification (chip size,position, ID number and other information), auto-focusing, positioning, picking, detection, product height detection, and other functions.

在结构上采用双通道布局，视觉算法和操作控制上独立运行，减少芯片检测设备的空闲时间，有效地解决单一通道因故障而无法进行芯片的运输和检测的问题，在较小的空间进一步提高了运送效率；

Adopting a dual channel layout in structure, visual algorithms and operational controls run independently, reducing the idle time of chip detection equipment, effectively solving the problem of single channel failure preventing chip transportation anddetection,and further improving transportation efficiency in a smaller space.

▪检测精度：170nm/pixel（最高兼容34nm）

  Detection precision: 170nm/pixel (up to 34nm compatible)

▪检测准确率：≥ 99.8%

Detection accuracy: ≥ 99.8%

▪检测缺陷种类：表面污染、镀膜异常、刮伤、断裂、破损、水波纹、镀膜异色、小黄点、暗裂纹等

Types of Detection Defects：Surface contamination, abnormal coating, scratches, fractures, breaks, water ripples, dark cracks, etc.